Expertise
Technical Expertise
GRL helps customers implement connectivity technologies by providing compliance, characterization, and signal integrity test and debug services. These test services are centered around GRL's expertise in providing a wide range of electrical, protocol, and system level tests to a various connectivity standards.
GRL goes beyond testing and helps customers if they need additional design, modeling, and simulation support in the areas of signal integrity, SERDES, IBIS, as well as IC packaging, PCB, and FPGA/IC design.
As high speed connectivity technologies become faster and more complex, a combination of test, debug and design is all the more essential to successful technology implementation and product release.
GRL goes beyond testing and helps customers if they need additional design, modeling, and simulation support in the areas of signal integrity, SERDES, IBIS, as well as IC packaging, PCB, and FPGA/IC design.
As high speed connectivity technologies become faster and more complex, a combination of test, debug and design is all the more essential to successful technology implementation and product release.
Meet GRL's Experts
At GRL, we feel it's important to know who's testing your products. Our test experts are recognized veterans in the test & measurement and semiconductor industries and can help you with your test, debug, and design needs.
Mike Engbretson
Mike spent the last 20 years of his career at Tektronix developing test solutions to support connectivity technologies such as USB, PCI Express, and SATA. Mike is a recognized high speed test guru and was active in the development of the USB 3.0 electrical compliance test spec and is currently the editor of the DisplayPort 1.2 electrical compliance test spec. Eugene Sushansky
Eugene spent over 14 years at PLX, a leading supplier of PCI Express semiconductor products. Eugene's engineering responsibilities included IC system architecture, design, verification, and validation for PCI Express 1.0/2.0 and USB 2.0 related products. Eugene actively participated in the PCI SIG Serial Enabling Group and PICMG Hot Swap committees.Tom Purdy
Tom spent 25 years at Agilent/HP where he spent most of his career supporting test equipment as an applications engineer. Tom was Agilent's main digital applications engineer in the Western Region for HDMI, DisplayPort, and MIPI. Tom excelled at training customers on how to use Agilent equipment to test these standards.Bent Hessen-Schmidt
Bent spent 25 years in Tektronix/SyntheSys Research, Wireless Telecom Group/Noisecom, SiGe Semiconductor, and Crimp A/S. Bent is a recognized expert in high speed connectivity testing and has been active in 10G Ethernet, SAS, Fibre Channel, PCI Express Gen 3, and DisplayPort spec and test solution development.Nhon Do
Nhon spent 18 years at AMD and Mentor Graphics, with most of his career focused on IC packaging design, signal integrity, power integrity, and IBIS modeling issues associated with large SoC designs. Nhon is an expert in both time domain reflection (TDR) and vector network analyzer (VNA) domain measurements and equipment. Nhon is also an expert using signal integrity tools such as Ansoft HFSS, Agilent ADS, and iConnect.Ben Chia
Ben spent 19 years in Rambus and HAL Computer Systems in the field of high speed bus modeling and signal integrity. Ben is an expert in DDR2/3 and 10G backplane technologies and in using Synopsys HSpice, Ansoft HFSS, Agilent ADS, and AtaiTec X2D signal integrity modeling tools to develop PCB, package, connector, signal integrity channel, and IBIS AMI models.