Technical Leadership

GRL’s experts are recognized veterans in the Test & Measurement and Semiconductor Industries and bring years of experience to address challenging testing, debugging, and design needs.

Mike Engbretson, Chief Technology Engineer
Mike spent the last 20 years at Tektronix developing test solutions to support connectivity technologies such as USB, PCI Express, and SATA. Mike is a recognized high speed test guru and was active in the development of the USB 3.0 electrical Compliance Test Spec and is currently the editor of the DisplayPort 1.2 electrical Compliance Test Spec.
Miki Takahashi,Vice President of Engineering
Miki spent 15 years at O2Micro, Advanced Chip Express and NEC most recently as Analog Design Manager, taking the lead in SERDES IP development and integration into ICs and systems. Miki is an expert in SERDES design, SD Interfaces (UHS-1, UHS-2), CF Interfaces (CFast, XQD), and JEDEC (DDR, UFS). Miki currently Chairs the SD Card Association UHS-TG to drive SI discussion and test specification for UHS-II (SD4.0)
Steve Bright, Director of Global Engineering
Steve spent over 30 years at Tektronix most recently as a senior application engineer. Steve served as one of Tek’s top field engineers in the Western Region for scope and BERT applications and represented Tek on various standards committees and workshops. Steve has deep expertise in 10GbE, PCIe Gen3, USB 3.0, 6Gb/12Gb SAS, SATA, DisplayPort and HDMI.
Sandy Chang, Taiwan Technical Director
Sandy spent 14 years at J-Micron and Agilent/HP most recently as System Design Manager. Sandy is an expert in SATA, USB, PCI Express, HDMI, DisplayPort, DDR, and Ethernet compliance, characterization, and debugging.
Rajaraman Venkatachalam, Software Architect & India Technical Director
Raja spent over 14 years at Tektronix, Intel and Prodigy Technovations leading the development of automated testing solutions for high speed digital interfaces. Raja has deep experience in post-silicon validation methodologies and developing electrical and protocol compliance testing tools, and is an expert in HDMI, MHL, DisplayPort, UniPro, PCI Express, SD, I2C, SPI, UART, and MMC.

Darren W. Gray, Director of Engineering
Darren spent over 8 years at Tektronix/Synthesys Research where he was a senior application engineer. Darren is an expert in receiver testing, and his wide-breadth of expertise in high-speed serial data standards includes USB 3.0, PCI Express, DisplayPort, and MIPI M-PHY.
Cyan Chen, Engineering Manager, GRL China
Cyan spent 12 years at Mitac, Flextronix and Jabil as Signal Integrity test engineer, focusing on the validation of enterprise computing, networking, and storage systems. Cyan has extensive experience in DDR, PCI Express, SAS, SATA, USB, and Ethernet, as well as PCB impedance and S-parameter validation.
Kiyoki Sekine, Engineering Manager, GRL Japan
Kiyoki spent 22 years as an engineer for communication engineering area in OKI, Lucent Technologies, HMS Industrial Networks and XXCAL Japan. Kiyoki has expertise in USB (2.0/3.1/Power Delivery), RF/DSP (3GPP, WiFi and ZigBee), and Industrial Ethernet. Kiyoki is the certified test engineer from USB-IF and qualified as Professional Engineer, Japan (IE) from Japanese government.

Shibin Veerendrakumar, Senior Engineering Manager, GRL India
Shibin
Shibin spent last 11 years at Intel ,Nvidia , Freescale and ST Microelectronics, most recently as Staff Engineer. Shibin has deep experience in post-silicon validation and protocol compliance testing and is an expert in System integration, SOC bring up , PCI Express, USB, MIPI, DDR ,LPDDR , Laser diode driver, ADC & DAC.
Chin Hun Yaep, Senior Software R&D Engineer
Chin Hun Yaep has over 11 years of experience developing automated test solutions at Agilent, Vitrox, and Intel, most recently as a Senior Software Engineer. Chin Hun has especially deep expertise in DisplayPort , HDMI, and MHL transmitter testing solutions.
Hermann Ruckerbauer, Senior Signal Integrity Consultant
Hermann
Hermann has over twenty years’ experience in high speed measurement and simulation, especially on DRAM-related interfaces. Prior to GRL, Hermann performed design analysis and application testing for several memory generations at Siemens/Infineon, and defined the DDR4 JEDEC signaling standard for Qimonda. Hermann has special expertise in DRAM internal functionally, system application requirements and high speed signaling, as well as other high speed standards including 10G Ethernet, PCIe, SATA, and USB. Author of many patents, in 2005 Hermann was awarded ‘Outstanding Single Patent’ from Infineon for “Temperature Dependent Self Refresh” in DDR memory devices.
Ben Chia, Senior Signal Integrity Consultant
Ben spent 19 years in Rambus and HAL Computer Systems in the field of high speed bus modeling and signal integrity. Ben is an expert in signal integrity measurement/precision probing, DDR2/3 and 10G backplane technologies, and in using Synopsys HSpice, Ansoft HFSS, Agilent ADS, and AtaiTec X2D signal integrity modeling tools to develop PCB, package, connector, signal integrity channel, and IBIS AMI models.
Tom Purdy, Senior Consultant
Tom spent 25 years at Agilent/HP where he spent most of his career supporting test equipment as an applications engineer. Tom was Agilent’s main digital applications engineer in the Western Region for HDMI, DisplayPort, and MIPI. Tom excelled at training customers on how to use Agilent equipment to test these standards.
Katsuhiro Watanabe, Technical Marketing Manager
Katsuhiro Watanabe
Katsuhiro spent over 35 years at Tektronix most recently as a technical marketing manager for high speed digital, RF and Video test and measurement. Katsuhiro has deep experience in high speed serial interface, especially video and display interfaces. He was active in the development of the HDMI electrical Compliance Test Spec.